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Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly Manufacturing, Reliability and Testing

Audio-visual / Multimedia Item (02 Sep 2011)

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    Other formats & editions

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    Hardback (21 Oct 2011) $167.10

    Publisher's Synopsis

    This work teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of microelectronic package assembly Liu and Liu begin with an overview of mechanics and modeling, including modeling validation tools and an explanation of concurrent engineering.

    Book information

    ISBN: 9780470827826
    Publisher: Chemical Industry
    Imprint: Wiley Blackwell
    Pub date:
    DEWEY: 621.381046
    DEWEY edition: 23
    Language: English
    Number of pages: 564
    Weight: 666g
    Height: 250mm
    Width: 150mm
    Spine width: 15mm

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