Publisher's Synopsis
The text Micromechanics of Composite Materials presents a broad exposition of analytical and numerical methods for modeling composite materials, laminates, polycrystals and other heterogeneous solids, with emphasis on connections between material properties and responses on several length scales, ranging from the nano and microscales to the macroscale. Micromechanical modeling and effective properties of the smart grid-reinforced composites have been focused in first chapter. Second chapter discusses recent advances of interfacial micromechanics in fiber reinforced composites using micro-Raman spectroscopy. Third chapter focuses on multilayered coating structures on soft, flexible CFC composites substrates in comparison to comparatively hard and stiff austenite steel. In fourth chapter, we present a new and relatively simple micromechanics-based interface model which takes into account the interaction between delamination and microcracking. Fifth chapter describes the analytical and experimental characterization of a class of polymeric composites made from epoxy matrix reinforced with unidirectional natural sisal and banana fibers with silica microparticles and maleic anhydride fabricated by manual molding. The aim of sixth chapter is to investigate the comprehensive influence of three microstructure parameters (fiber cross-section shape, fiber volume fraction, and fiber off-axis orientation) and strain rate on the macroscopic property of a polymer matrix composite. Self-consistent micromechanical enhancement of continuous fiber composites has been outlined in seventh chapter. Micromechanics modeling on electrical conductivity of CNT-polymer composites has been discussed in eighth chapter. Effect of the curing process on the transverse tensile strength of fiber-reinforced polymer matrix lamina using micromechanics computations has been investigated in ninth chapter. Micromechanics modeling of the electrical conductivity of carbon nanotude (CNT)-polymer nanocomposites has been proposed in tenth chapter.