Hardback (31 Dec 1988)
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Out of stock
Explains the latest design methods, modeling tools, simulation techniques, and manufacturing procedures of microelectronics packaging.
| ISBN: | 9780442205782 |
| Publisher: | Springer |
| Imprint: | Van Nostrand Reinhold |
| Pub date: | 31 Dec 1988 |
| DEWEY: | 621.3817 |
| DEWEY edition: | 19 |
| Number of pages: | 1194 |
| Weight: | 1791g |
| Height: | 241mm |
| Width: | 171mm |
| Spine width: | 57mm |
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