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Microelectronic Packaging Technology

Microelectronic Packaging Technology Materials and Processes : Proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

Book (31 Dec 1989)

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    Publisher's Synopsis

    Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno

    Book information

    ISBN: 9780871703590
    Publisher: ASM International
    Imprint: ASM International
    Pub date:
    DEWEY: 621.381046
    DEWEY edition: 20
    Language: English
    Number of pages: 479
    Weight: 1632g
    Height: 230mm
    Width: 222mm
    Spine width: 31mm

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