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Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III

Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III 1-2 October, 1997, Austin, Texas - SPIE Proceedings Series

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Book information

ISBN: 9780819426482
Publisher: SPIE
Imprint: SPIE
Pub date:
DEWEY: 621.381
DEWEY edition: 21
Language: English
Number of pages: 198
Weight: 498g
Height: 266mm
Width: 209mm
Spine width: 12mm