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Micro-Assembly Technologies and Applications

Micro-Assembly Technologies and Applications IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France, February 10-13, 2008 - IFIP Advances in Information and Communication Technology

Softcover reprint of hardcover 1st ed. 2008

Paperback (19 Nov 2010)

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Publisher's Synopsis

Book information

ISBN: 9781441945914
Publisher: Springer US
Imprint: Springer
Pub date:
Edition: Softcover reprint of hardcover 1st ed. 2008
DEWEY: 670.427
DEWEY edition: 22
Language: English
Number of pages: 416
Weight: 658g
Height: 234mm
Width: 156mm
Spine width: 22mm