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Mechanical Analysis of Electronic Packaging Systems

Mechanical Analysis of Electronic Packaging Systems

Paperback (05 Sep 2019)

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Publisher's Synopsis

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Book information

ISBN: 9780367399818
Publisher: CRC Press
Imprint: CRC Press
Pub date:
DEWEY: 621.381046
DEWEY edition: 23
Language: English
Number of pages: 374
Weight: 725g
Height: 229mm
Width: 152mm
Spine width: 20mm