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Materials, Technology, and Reliability for Advanced Interconnects and Low-K Dielectrics--2004

Materials, Technology, and Reliability for Advanced Interconnects and Low-K Dielectrics--2004 Symposium Held April 13-15, 2004, San Francisco, California, U.S.A - Materials Research Society Symposium Proceedings

Hardback (01 Sep 2004)

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Publisher's Synopsis

The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.

About the Publisher

Cambridge University Press

Cambridge University Press dates from 1534 and is part of the University of Cambridge. We further the University's mission by disseminating knowledge in the pursuit of education, learning and research at the highest international levels of excellence.

Book information

ISBN: 9781558997622
Publisher: Materials Research Society
Imprint: Cambridge University Press
Pub date:
DEWEY: 621.8672
DEWEY edition: 22
Language: English
Number of pages: 402
Weight: 677g
Height: 234mm
Width: 160mm
Spine width: 28mm