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Materials, Integration and Packaging Issues for High-Frequency Devices II

Materials, Integration and Packaging Issues for High-Frequency Devices II Symposium Held November 29-December 1, 2004, Boston, Massachusetts, U.S.A - Materials Research Society Symposium Proceedings

Book (01 Jan 2005)

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Book information

ISBN: 9781558997813
Publisher: Materials Research Society
Imprint: Materials Research Society
Pub date:
DEWEY: 621.381046
DEWEY edition: 22
Number of pages: 270