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Materials Developments in Microelectronic Packaging

Materials Developments in Microelectronic Packaging Performance and Reliability : Proceedings of the Fourth Electronic Materials and Processing Congress

Book (31 Dec 1991)

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Publisher's Synopsis

The proceedings of the Fourth Electronic Materials and Processing Conference, held in Montreal in 1991, cover the latest developments in multichip modules, surface mount technology, microelectronic interconnections, electronic and fiber optic connectors, and microelectronic corrosion in 53 papers. I

Book information

ISBN: 9780871704351
Publisher: ASM International
Imprint: ASM International
Pub date:
DEWEY: 621.381046
DEWEY edition: 20
Language: English
Number of pages: 403
Weight: -1g
Height: 230mm