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Manufacturing Processes and Materials Challenges in Microelectronic Packaging

Manufacturing Processes and Materials Challenges in Microelectronic Packaging Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 - AMD

Book (01 Jan 1991)

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Book information

ISBN: 9780791808962
Publisher: The Society
Imprint: The Society
Pub date:
DEWEY: 621.381046
DEWEY edition: 20
Language: English
Number of pages: 153
Weight: -1g
Height: 285mm
Width: 222mm
Spine width: 12mm