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Lead-Free Soldering Process Development and Reliability

Lead-Free Soldering Process Development and Reliability - Wiley Series in Quality & Reliability Engineering

Audio-visual / Multimedia Item (03 Jul 2020)

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Publisher's Synopsis

This volume discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards.

Book information

ISBN: 9781119482093
Publisher: Wiley Blackwell
Imprint: Wiley Blackwell
Pub date:
DEWEY: 621.381046
DEWEY edition: 23
Language: English
Number of pages: 512
Weight: 666g
Height: 250mm
Width: 150mm
Spine width: 15mm