Delivery included to the United States

LCP for Microwave Packages and Modules

LCP for Microwave Packages and Modules - The Cambridge RF and Microwave Engineering Series

Hardback (21 Jun 2012)

  • $145.70
Add to basket

Includes delivery to the United States

1 copy available online - Usually dispatched within 72 hours

Publisher's Synopsis

A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.

About the Publisher

Cambridge University Press

Cambridge University Press dates from 1534 and is part of the University of Cambridge. We further the University's mission by disseminating knowledge in the pursuit of education, learning and research at the highest international levels of excellence.

Book information

ISBN: 9781107003781
Publisher: Cambridge University Press
Imprint: Cambridge University Press
Pub date:
DEWEY: 621.3813
DEWEY edition: 23
Language: English
Number of pages: 253
Weight: 68g
Height: 248mm
Width: 179mm
Spine width: 17mm