Book (31 Mar 2001)
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Out of stock
Topics covered in this book include: active devices; automotive electronics; ball grid array package; chip scale packages; design, modelling, simulation; flex circuits; HDTV; high density packaging; intelligent transportation; interconnects, bonding; and laser processing.
| ISBN: | 9780930815646 |
| Publisher: | IMAPS |
| Imprint: | IMAPS |
| Pub date: | 31 Mar 2001 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 414 |
| Weight: | -1g |
| Height: | 266mm |
| Width: | 203mm |
| Spine width: | 25mm |
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