Hardback (30 Sep 2000)
Not available for sale
Out of stock
These conference proceedings cover such topics as: high density packaging materials; automotive electronics; system level packaging; chip scale packaging; optoelectronics; power packaging; sensors; actuators, and MEMS; flex circuits; and thermal management.
| ISBN: | 9780930815592 |
| Publisher: | IMAPS |
| Imprint: | IMAPS |
| Pub date: | 30 Sep 2000 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 349 |
| Weight: | -1g |
| Height: | 266mm |
| Width: | 209mm |
| Spine width: | 25mm |
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