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International Conference on Wafer Scale Integration, 1993 Proceedings

International Conference on Wafer Scale Integration, 1993 Proceedings

Hardback (15 Jun 2006)

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Publisher's Synopsis

The conference held January 1993, in San Francisco, heard 37 papers from industry and academia, equal emphasis being given to monolithic-WSI and hybrid-WSI topics the latter form covering complex (i.e. larger area and higher chip-count) silicon-on-silicon multichip modules. No index. Annotation copyright Book News, Inc. Portland, Or.

Book information

ISBN: 9780780308671
Publisher: I.E.E.E.Press
Imprint: I.E.E.E.Press
Pub date:
Language: English
Number of pages: 374
Weight: 680g
Height: 241mm
Width: 165mm
Spine width: 25mm