Delivery included to the United States

Interconnect Technology and Design for Gigascale Integration

Interconnect Technology and Design for Gigascale Integration

Softcover reprint of the original 1st Edition 2003

Paperback (14 Oct 2012)

  • $188.50
Add to basket

Includes delivery to the United States

10+ copies available online - Usually dispatched within 7 days

Publisher's Synopsis

Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.

Book information

ISBN: 9781461350880
Publisher: Springer US
Imprint: Springer
Pub date:
Edition: Softcover reprint of the original 1st Edition 2003
Language: English
Number of pages: 411
Weight: 652g
Height: 235mm
Width: 155mm
Spine width: 22mm