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Interconnect Technology and Design for Gigascale Integration

Interconnect Technology and Design for Gigascale Integration

2003

Hardback (31 Oct 2003)

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Publisher's Synopsis

Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.

Book information

ISBN: 9781402076060
Publisher: Springer US
Imprint: Springer
Pub date:
Edition: 2003
DEWEY: 621.38152
DEWEY edition: 22
Language: English
Number of pages: 411
Weight: 1720g
Height: 234mm
Width: 156mm
Spine width: 23mm