Book (30 Nov 2008)
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Describes the breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. This book provides engineers with details on I/O interconnects and packaging, along with the advances and applications in power delivery design, analysis, and modeling.
| ISBN: | 9781596932463 |
| Publisher: | Artech House |
| Imprint: | Artech House |
| Pub date: | 30 Nov 2008 |
| DEWEY: | 621.381 |
| DEWEY edition: | 22 |
| Number of pages: | 528 |
| Weight: | 1089g |
| Height: | 257mm |
| Width: | 183mm |
| Spine width: | 33mm |
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