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Integrated Circuit and Manufacturing Method Thereof

Integrated Circuit and Manufacturing Method Thereof United States Patent 9985031

Paperback (28 Dec 2020)

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Publisher's Synopsis

An integrated circuit includes a substrate, at least one n-type semiconductor device, and at least one p-type semiconductor device. The n-type semiconductor device is present on the substrate. The n-type semiconductor device includes a gate structure having a bottom surface and at least one sidewall. The bottom surface of the gate structure of the n-type semiconductor device and the sidewall of the gate structure of the n-type semiconductor device intersect to form an interior angle. The p-type semiconductor device is present on the substrate. The p-type semiconductor device includes a gate structure having a bottom surface and at least one sidewall. The bottom surface of the gate structure of the p-type semiconductor device and the sidewall of the gate structure of the p-type semiconductor device intersect to form an interior angle smaller than the interior angle of the gate structure of the n-type semiconductor device.

Book information

ISBN: 9798584667474
Publisher: Independently Published
Imprint: Independently Published
Pub date:
Language: English
Number of pages: 28
Weight: 91g
Height: 280mm
Width: 216mm
Spine width: 2mm