Paperback (20 Aug 2016)
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This special issue aims to provide a high level research paper for researchers, engineers and scientists to present their new advances and research results in the field of materials and innovative technologies for mechanical engineering, construction electronic packaging.
| ISBN: | 9783038356714 |
| Publisher: | Trans Tech Publications Ltd |
| Imprint: | Trans Tech Publications |
| Pub date: | 20 Aug 2016 |
| Language: | English |
| Number of pages: | 278 |
| Weight: | -1g |
| Height: | 240mm |
| Width: | 170mm |
| Spine width: | 14mm |
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