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Grain Boundary Engineering of Electronic Ceramics

Grain Boundary Engineering of Electronic Ceramics Proceedings of a COST 525 Meeting Held in Aveiro, Portugal, October 2001 - British Ceramic Proceedings

Hardback (26 Sep 2003)

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Publisher's Synopsis

This book contains the proceedings of COST 525: Advanced Electroceramics - Grain boundry engineering, the main objective of which is to understand the role played by grain boundaries in controlling manufacture and microstructure, originally available in British ceramic proceedings Issue 63.

Book information

ISBN: 9781902653778
Publisher: Taylor and Francis
Imprint: CRC Press
Pub date:
Language: English
Number of pages: 206
Weight: 590g
Height: 254mm
Width: 177mm
Spine width: 19mm