Book (31 Dec 1994)
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Unlike earlier electronic circuits, today's microelectronic devices demand that solder serve structural as well as electrical ends, and do so at relatively high temperature for years. Fatigue and failure of the solder has therefore become an issue in the industry. Nine studies from a May 1993 symposium in Atlanta, Georgia, address such aspects of t
| ISBN: | 9780803119949 |
| Publisher: | ASTM |
| Imprint: | ASTM |
| Pub date: | 31 Dec 1994 |
| DEWEY: | 621.381531 |
| DEWEY edition: | 20 |
| Language: | English |
| Number of pages: | 146 |
| Weight: | 226g |
| Height: | 228mm |
| Width: | 152mm |
| Spine width: | 12mm |
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