Hardback (18 Dec 2014)
Not available for sale
Out of stock
This set focuses on thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order 'compact' thermal models of electronic components, and a comprehensive exploration of thermally-informed electronic design.
| ISBN: | 9789814327602 |
| Publisher: | World Scientific |
| Imprint: | World Scientific Publishing |
| Pub date: | 18 Dec 2014 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 23 |
| Language: | English |
| Number of pages: | 1396 |
| Weight: | 3596g |
| Height: | 256mm |
| Width: | 176mm |
| Spine width: | 113mm |
$0.34off
Get Started With MicroPython on...
Paperback
Published 25 Jun 2024
Save $0.34
$61.13off
Lab Manual for Analog Fundament...
Paperback
Published 13 Aug 2012
Save $61.13
$41.30off
Telephone Installation Handbook
Paperback
Published 30 May 2001
Save $41.30
$78.49off
Quality Management for Organiza...
Paperback
Published 02 Aug 2013
Save $78.49
$4.15off
Cyber Physical Systems
Paperback
Published 08 Oct 2024
Save $4.15
$3.98off
Advanced Power Electronics Conv...
Paperback
Published 29 Nov 2024
Save $3.98
$3.51off
Applications of Machine Learnin...
Paperback
Published 07 Oct 2024
Save $3.51
Photovoltaic Partial Shading
Hardback
Published 18 Sep 2024
$3.66off
Digital Health Transformation W...
Paperback
Published 07 Oct 2024
Save $3.66
Robust Control Algorithms for F...
Hardback
Published 18 Oct 2024