Book (31 May 1994)
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Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent d
| ISBN: | 9780780304390 |
| Publisher: | IEEE Press |
| Imprint: | IEEE Press |
| Pub date: | 31 May 1994 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 20 |
| Language: | English |
| Number of pages: | 392 |
| Weight: | -1g |
| Height: | 241mm |
| Width: | 165mm |
| Spine width: | 31mm |
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