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Electronic and Photonic Packaging, Integration and Packaging of Micro/nano/electronic Systems--2005

Electronic and Photonic Packaging, Integration and Packaging of Micro/nano/electronic Systems--2005 Presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA - EPP

Paperback (30 Mar 2006)

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Book information

ISBN: 9780791842171
Publisher: American Society of Mechanical Engineers
Imprint: ASME
Pub date:
DEWEY: 621.381046
DEWEY edition: 22
Number of pages: 606
Weight: -1g