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Electronic Packaging

Electronic Packaging Materials and Processes to Reduce Package Cycle Time and Improve Reliability : Proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA

Book (31 Dec 1992)

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Publisher's Synopsis

Over 50 papers from an August 1992 conference in Cambridge, Massachusetts, review recent developments in electronic packaging and interconnect technology, microelectronic materials fabrication and characterization, device reliability, failure analysis methods, and multichip module-packaging. Well illustrated. No index. Member price, $75.20. Annotat

Book information

ISBN: 9780871704498
Publisher: ASM International
Imprint: ASM International
Pub date:
DEWEY: 621.381046
DEWEY edition: 20
Language: English
Number of pages: 260
Weight: -1g
Height: 230mm