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Electronic Packaging Materials Science VII: Volume 323

Electronic Packaging Materials Science VII: Volume 323 - MRS Proceedings

Hardback (21 Mar 1994)

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Publisher's Synopsis

Proceedings of the symposium held at the MRS 1993 Fall Meeting in Boston. The symposium dealt with materials science related to the development of electronic packaging, and the proceedings focus on five specific areas: low-cost high-performance packages; deposition and durability; packaging material

About the Publisher

Cambridge University Press

Cambridge University Press dates from 1534 and is part of the University of Cambridge. We further the University's mission by disseminating knowledge in the pursuit of education, learning and research at the highest international levels of excellence.

Book information

ISBN: 9781558992221
Publisher: Materials Research Society
Imprint: Cambridge University Press
Pub date:
Language: English
Number of pages: 472
Weight: 1000g
Height: 236mm
Width: 155mm
Spine width: 28mm