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Electronic Packaging Materials Science IV: Volume 154

Electronic Packaging Materials Science IV: Volume 154 - MRS Proceedings

Hardback (06 Dec 1989)

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Publisher's Synopsis

Symposium held April 1989, San Diego, California. Emphasis is on the fundamental materials and processing problems encountered in the packaging of VLSI and VHSIC devices, and their interconnection into large arrays. Acidic paper. Annotation copyright Book News, Inc. Portland, Or.

About the Publisher

Cambridge University Press

Cambridge University Press dates from 1534 and is part of the University of Cambridge. We further the University's mission by disseminating knowledge in the pursuit of education, learning and research at the highest international levels of excellence.

Book information

ISBN: 9781558990272
Publisher: Materials Research Society
Imprint: Cambridge University Press
Pub date:
Language: English
Number of pages: 522
Weight: 1000g
Height: 233mm
Width: 147mm
Spine width: 38mm