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Design and Process Integration for Microelectronic Manufacturing II [Sic]

Design and Process Integration for Microelectronic Manufacturing II [Sic] 26-27 February 2004, Santa Clara, California, USA - SPIE Proceedings Series

Paperback (31 May 2004)

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Publisher's Synopsis

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

Book information

ISBN: 9780819452924
Publisher: SPIE
Imprint: SPIE
Pub date:
DEWEY: 621.381
DEWEY edition: 22
Language: English
Number of pages: 302
Weight: 748g
Height: 273mm
Width: 209mm
Spine width: 19mm