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Design, Test, Integration and Packaging of MEMS/MOEMS 2003

Design, Test, Integration and Packaging of MEMS/MOEMS 2003 DTIP 2003 : 5-7 May, 2003, Cannes, France

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Book information

ISBN: 9780780370661
Publisher: IEEE
Imprint: IEEE
Pub date:
DEWEY: 621.381
DEWEY edition: 22
Language: English
Number of pages: 411
Weight: 0g
Height: 0mm
Width: 0mm