Publisher's Synopsis
This refereed collection of 22 invited and contributed papers includes both overview and current research. Its primary focus is the interconnection between defect structure, morphology and mechanical properties of thin electrodeposit layers, and a comparison of the characteristics of chemical and vapour deposits.;Coverage includes: substructure formation and texture in electrodeposits; surface morphology of electrodeposits, electrodeposition pattern formation - an overview; origin of internal stresses in electrolytic coatings; electrochemical processing of nanostructured materials; and enhanced stress migration reliability for ULSI interconnect - an insight into perils of screening AI deposits based on grain size.
