Publisher's Synopsis
This collection of papers, from the symposium held during Materials Week 96 in Cincinnati, Ohio, October 7-10, 1996, deals with creep, stress relaxation and time-dependent deformation of miniature structures (films, foils, fibres, solder bumps) and their components (metals and polymers). It is recognized that the mechanical properties of small-scaled samples tend to differ from those of bulk materials of identical composition. The long-term deformation, with ultimate rupture or failure, becomes a serious reliability hazard. These two aspects - properties and performance - are examined in depth.;Coverage includes: modelling creep in complex engineering alloys; impression recovery of polymers; creep, stress relaxation and plastic deformation in Sn-Ag and Sn-Zn eutectic solders; and implications and applications of zero-creep experiments for the stability of multilayer structures.
