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Copper Electrodeposition for Nanofabrication of Electronics Devices

Copper Electrodeposition for Nanofabrication of Electronics Devices - Nanostructure Science and Technology

2014

Hardback (21 Nov 2013)

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Publisher's Synopsis

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as:  ULSI wiring material based upon copper nanowiring  Printed circuit boards  Stacked semiconductors  Through Silicon Via  Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

Book information

ISBN: 9781461491750
Publisher: Springer New York
Imprint: Springer
Pub date:
Edition: 2014
Language: English
Number of pages: 282
Weight: 606g
Height: 235mm
Width: 155mm
Spine width: 18mm