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CMOS Plasma and Process Damage

CMOS Plasma and Process Damage

Hardback (17 May 2025)

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Publisher's Synopsis

This book discusses the complex technology of building CMOS computer chips and covers some of the unusual problems that can occur during chip manufacturing. Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems. 

Book information

ISBN: 9783031890284
Publisher: Springer Nature Switzerland
Imprint: Springer
Pub date:
DEWEY: 621.39732
DEWEY edition: 23
Language: English
Number of pages: 466
Weight: -1g
Height: 235mm
Width: 155mm