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CAE/CAD and Thermal Management Issues in Electronic Systems

CAE/CAD and Thermal Management Issues in Electronic Systems Presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas - EEP

Paperback (30 Nov 1997)

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    Publisher's Synopsis

    Proceedings of the November 1997 symposium. Twelve papers relate to the use of computer simulations to solve complex packaging problems related to thermo/mechanical problems. Topics include improving electronic packaging manufacturing through product and process-driven analysis; thermo-mechanical an

    Book information

    ISBN: 9780791818527
    Publisher: American Society of Mechanical Engineers
    Imprint: ASME
    Pub date:
    DEWEY: 621.381046
    DEWEY edition: 21
    Number of pages: 109
    Weight: -1g
    Height: 230mm

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