Delivery included to the United States

Applications of Experimental Mechanics to Electronic Packaging

Applications of Experimental Mechanics to Electronic Packaging Presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California - EEP

Paperback (30 Nov 1995)

Not available for sale

Out of stock

This service is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Book information

ISBN: 9780791817391
Publisher: American Society of Mechanical Engineers
Imprint: ASME
Pub date:
Number of pages: 117
Weight: -1g
Height: 230mm