Paperback (30 Nov 1997)
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Proceedings of the November 1997 symposium, a forum for presentation of research in all aspects of experimental mechanics as applied to electronic packaging. Session topics included test chips, sensors, optical methods, micromechanical testing, and mechanics of thin film debonding.
| ISBN: | 9780791818503 |
| Publisher: | American Society of Mechanical Engineers |
| Imprint: | ASME |
| Pub date: | 30 Nov 1997 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Number of pages: | 136 |
| Weight: | -1g |
| Height: | 280mm |
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