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Application of Fracture Mechanics in Electronic Packaging

Application of Fracture Mechanics in Electronic Packaging Presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas - AMD

Paperback (30 Nov 1997)

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Publisher's Synopsis

Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components even while they become faster, smaller, and cheaper.

Book information

ISBN: 9780791818275
Publisher: American Society of Mechanical Engineers
Imprint: ASME
Pub date:
DEWEY: 621.381046
DEWEY edition: 21
Number of pages: 193
Weight: -1g
Height: 280mm