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Application of Fracture Mechanics in Electronic Packaging and Materials

Application of Fracture Mechanics in Electronic Packaging and Materials Presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California - EEP

Book (31 Dec 1995)

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Publisher's Synopsis

Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical analyses, interfacial integrity and reliability, appli

Book information

ISBN: 9780791817360
Publisher: American Society of Mechanical Engineers
Imprint: American Society of Mechanical Engineers
Pub date:
DEWEY: 621.381046
DEWEY edition: 21
Language: English
Number of pages: 271
Weight: 657g
Height: 285mm
Width: 222mm
Spine width: 19mm