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Advances in Electronic Circuit Packaging

Advances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, Sponsored by the University of Colorado and EDN (Electrical Design News), Held at Boulder, Colorado

Softcover reprint of the original 1st Edition 1962

Paperback (01 Jan 1962)

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Book information

ISBN: 9781489972972
Publisher: Springer US
Imprint: Springer
Pub date:
Edition: Softcover reprint of the original 1st Edition 1962
Language: English
Number of pages: 328
Weight: 662g
Height: 254mm
Width: 178mm
Spine width: 18mm