Delivery included to the United States

Adhesive Bonding in Photonics Assembly and Packaging

Adhesive Bonding in Photonics Assembly and Packaging

Book (01 Jan 2003)

Not available for sale

Out of stock

This service is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Publisher's Synopsis

Yacobi (U. of Toronto) and Hubert (Exfor Photonic Solutions, Canada) have expanded a review published in the Journal of Applied Physics on a subject crucial to a wide variety of applications in microelectronics and photonics assemblies and packaging and to the manufacturing of optoelectronic and fiber-optic components, and of medical devices. Photo

Book information

ISBN: 9781588830197
Publisher: American Scientific
Imprint: American Scientific
Pub date:
DEWEY: 621.36
DEWEY edition: 22
Language: English
Number of pages: 173
Weight: -1g
Height: 237mm
Width: 158mm
Spine width: 13mm