Paperback (28 Jun 2022)
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3D Interconnect Architectures for Heterogeneous Technologies
| ISBN: | 9783030982300 |
| Publisher: | Springer Nature B.V. |
| Imprint: | Springer Nature B.V. |
| Pub date: | 28 Jun 2022 |
| Language: | English |
| Number of pages: | 424 |
| Weight: | 592g |
| Height: | 234mm |
| Width: | 156mm |
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