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3D IC and RF SiPs

3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility - IEEE Press

Hardback (19 Jun 2018)

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Publisher's Synopsis

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

  • Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
  • Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
  • Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
  • Provides chapter-wise review questions and powerpoint slides as teaching tools

Book information

ISBN: 9781119289647
Publisher: Wiley
Imprint: Wiley-IEEE Press
Pub date:
DEWEY: 621.38456
DEWEY edition: 23
Language: English
Number of pages: 464
Weight: 839g
Height: 239mm
Width: 168mm
Spine width: 28mm