Publisher's Synopsis
Topics discussed in the course of the meeting included: advanced devices; integrated circuits; planar and passive circuit structures; microelectromechanical structures; and modelling.
Book (30 Jun 2003)
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Topics discussed in the course of the meeting included: advanced devices; integrated circuits; planar and passive circuit structures; microelectromechanical structures; and modelling.
ISBN: | 9780780377875 |
Publisher: | IEEE |
Imprint: | IEEE |
Pub date: | 30 Jun 2003 |
DEWEY: | 621.38412 |
DEWEY edition: | 22 |
Language: | English |
Number of pages: | 202 |
Weight: | -1g |