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2002 3rd International Symposium on Electromagnetic Compatibility

2002 3rd International Symposium on Electromagnetic Compatibility May 21-24, 2002, Beijing, China

Book (15 Jun 2006)

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Book information

ISBN: 9780780372771
Publisher: IEEE
Imprint: IEEE
Pub date:
DEWEY: 621.38224
DEWEY edition: 22
Language: English
Weight: -1g
Height: 279mm
Width: 209mm
Spine width: 31mm