Publisher's Synopsis
In this book, the authors share over three decades of experience in the electronics industry, especially in the field of the semiconductor package assembly, and offer the latest developments and advances in IC packaging. The focus is on the area of 3D packaging, especially with regards to wafer level packaging and die stacking. The intent is to cover a basic understanding of these topics as related to advances in technology products in general in an easy-to-read format. The book covers such topics as:
Materials interactions and impact on performance and reliability
Trade-offs between different advanced packaging solutions in 2.5D, wafer fan-out, and the like
The latest technology trends and directions in the packaging market
Identifying packaging technology solutions for key product applications
Easy to read for non-experts in the field, this volume can be used as a valuable reference guide and manual for entry-level professionals or students considering a career in semiconductor manufacturing.
