Hardback (31 Oct 1998)
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This volume offers a broad spectrum of technical contributions in diverse areas of microelectronics interconnection and packaging technologies. Topics include: materials; flip chip/interconnection technologies; optical components and modules; and thin/thick film process technologies.
| ISBN: | 9780780350908 |
| Publisher: | IEEE |
| Imprint: | IEEE |
| Pub date: | 31 Oct 1998 |
| DEWEY: | 621.381046 |
| DEWEY edition: | 21 |
| Language: | English |
| Number of pages: | 391 |
| Weight: | -1g |
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