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1997 International Conference on Simulation of Semiconductor Processes and Devices

1997 International Conference on Simulation of Semiconductor Processes and Devices SISPAD '97, September 8-10, 1997, Cambridge, MA USA

Hardback (31 Dec 1997)

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    Publisher's Synopsis

    This conference is aimed at providing an opportunity for presentation and discussion of topics in process, device and circuit modelling for semiconductors. The proceedings contains all papers presented and should serve as a source for scientists and engineers engaged in research and development.

    Book information

    ISBN: 9780780337756
    Publisher: Institute of Electrical and Electronics Engineers
    Imprint: Institute of Electrical and Electronics Engineers
    Pub date:
    DEWEY: 621.38152015118
    DEWEY edition: 21
    Language: English
    Number of pages: 353
    Weight: -1g
    Height: 285mm
    Width: 222mm
    Spine width: 19mm

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