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11th International Congress Molded Interconnect Devices - Scientific Proceedings

11th International Congress Molded Interconnect Devices - Scientific Proceedings - Advanced Materials Research

Paperback (26 Nov 2014)

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Publisher's Synopsis

Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability.

Book information

ISBN: 9783038352525
Publisher: Trans Tech Publications Ltd
Imprint: Trans Tech Publications
Pub date:
Language: English
Number of pages: 130
Weight: -1g
Height: 240mm
Width: 170mm
Spine width: 7mm